Hypertec 256MB PC3200 (Legacy) memory module 0.25 GB 1 x 0.25 GB DDR 400 MHz DDR2 2 V Memory ranking 1

2 V Memory ranking 1 ECC Yes Memory clock speed 2666 MHz Internal memory type DDR4 Features Buffered memory type Registered (buffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for PC Memory form factor 288-pin DIMM CAS latency 19 Memory voltage 1

Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Memory form factor 204-pin SO-DIMM Module configuration 512M x 8 Memory clock speed 1333 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Memory form factor 204-pin SO-DIMM Module configuration 512M x 8 Memory clock speed 1333 MHz Internal memory type DDR3

35 V Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 2 x 8 GB Internal memory 16 GB Memory form factor 240-pin DIMM Memory voltage 1

Memory Buffered memory type Registered (buffered) Internal memory 16 GB Memory form factor 240-pin DIMM Memory ranking 2 Memory clock speed 1600 MHz Internal memory type DDR3L Features Buffered memory type Registered (buffered) Internal memory 16 GB Memory form factor 240-pin DIMM Memory ranking 2 Memory clock speed 1600 MHz Internal memory type DDR3L

2 V Design Cooling type Heatsink Technical details Cooling type Heatsink Memory Buffered memory type Registered (buffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for PC Memory form factor 288-pin DIMM CAS latency 19 Memory voltage 1

Hypertec 256MB PC3200 (Legacy) memory module 0.25 GB 1 x 0.25 GB DDR 400 MHz DDR2 2 V Memory ranking 1A Hypertec Legacy Memory Module is a module that uses no current DRAM technology and is no longer in mainstream production by OEMS and or third party suppliers. Hypertec are committed to providing a full memory upgrade landscape as part of our core product offering and as such, there may be occasions where we need to utilise professionally repurposed components. Any repurposed components are removed within a full ESD environment and then used to