Pay in 4 interest-free payments of $5.86 Learn more
Ships within 48 hours · Estimated delivery Aug 7 - Aug 12
Memory Buffered memory type Unregistered (unbuffered) Internal memory 8 GB Memory form factor 240-pin DIMM ECC No Memory clock speed 1600 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Internal memory 8 GB Memory form factor 240-pin DIMM ECC No Memory clock speed 1600 MHz Internal memory type DDR3
Memory Buffered memory type Unregistered (unbuffered) Internal memory 2 GB Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1600 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Internal memory 2 GB Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1600 MHz Internal memory type DDR3
A Fujitsu equivalent 8 GB Unbuffered Non-ECC DDR3 SDRAM - SO-DIMM 204-pin 1600 MHz ( PC3-12800 ) from Hypertec
Memory Buffered memory type Unregistered (unbuffered) Internal memory 4 GB Memory form factor 240-pin DIMM CAS latency 10 ECC No Memory clock speed 1600 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Internal memory 4 GB Memory form factor 240-pin DIMM CAS latency 10 ECC No Memory clock speed 1600 MHz Internal memory type DDR3
Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 4 GB Internal memory 4 GB Component for Laptop Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1600 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 4 GB Internal memory 4 GB Component for Laptop Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1600 MHz Internal memory type DDR3
Hypertec UC-N01-M304GB1-HY (Legacy) memory module 4 GB DDR3 1333 MHz ECC DDR2 Memory Buffered memory type UnregisteredA Hypertec Legacy Memory Module is a module that uses no current DRAM technology and is no longer in mainstream production by OEMS and or third party suppliers. Hypertec are committed to providing a full memory upgrade landscape as part of our core product offering and as such, there may be occasions where we need to utilise professionally repurposed components. Any repurposed components are removed within a full ESD environment and then used to
