Hypertec IBM equivalent 512MB DIMM DDR SDRAM (PC2700 ECC) (Legacy) memory module 0.5 GB 333 MHz 3200 Memory Buffered memory type Unregistered

Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Memory form factor 240-pin DIMM ECC Yes Memory clock speed 1600 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Memory form factor 240-pin DIMM ECC Yes Memory clock speed 1600 MHz Internal memory type DDR3

Memory Buffered memory type Registered (buffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Memory form factor 240-pin DIMM Memory ranking 1 ECC Yes Memory clock speed 1600 MHz Internal memory type DDR3 Features Buffered memory type Registered (buffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Memory form factor 240-pin DIMM Memory ranking 1 ECC Yes Memory clock speed 1600 MHz Internal memory type DDR3

2 V Design Backlight No Technical details Chips organisation 1Rx8 Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for PC Memory form factor 288-pin DIMM CAS latency 17 Memory voltage 1

Designed to maximise the performance of our memory modules

Memory Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Memory form factor 240-pin DIMM Memory clock speed 1333 MHz Internal memory type DDR3 Features Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Memory form factor 240-pin DIMM Memory clock speed 1333 MHz Internal memory type DDR3

Hypertec IBM equivalent 512MB DIMM DDR SDRAM (PC2700 ECC) (Legacy) memory module 0.5 GB 333 MHz 3200 Memory Buffered memory type UnregisteredA Hypertec Legacy Memory Module is a module that uses no current DRAM technology and is no longer in mainstream production by OEMS and or third party suppliers. Hypertec are committed to providing a full memory upgrade landscape as part of our core product offering and as such, there may be occasions where we need to utilise professionally repurposed components. Any repurposed components are removed within a full ESD environment and then used to