Hypertec 512MB PC133 (Legacy) memory module 0.5 GB 1 x 0.5 GB SDR SDRAM 133 MHz 3200 5 V Design Product colour

5 V Design Product colour Blue Cooling type Heatsink Technical details Product colour Blue Cooling type Heatsink Memory Internal memory 8 GB Component for PC/server Memory form factor 240-pin DIMM CAS latency 11 Memory voltage 1

2 V Memory ranking 2 ECC No Memory clock speed 2666 MHz Internal memory type DDR4 Weight & dimensions Package width 10 mm Package depth 150 mm Package height 55 mm Package weight 30 g Packaging data Package width 10 mm Package depth 150 mm Package height 55 mm Package weight 30 g

Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 2 GB Internal memory 2 GB Component for Laptop Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1600 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 2 GB Internal memory 2 GB Component for Laptop Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1600 MHz Internal memory type DDR3

2 V Design Backlight No Technical details Chips organisation 2Rx8 Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 16 GB Internal memory 16 GB Component for Laptop Memory form factor 260-pin SO-DIMM CAS latency 15 Memory voltage 1

2 V Memory ranking 2 ECC No Memory clock speed 2400 MHz Internal memory type DDR4 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 16 GB Internal memory 16 GB Component for Laptop Memory form factor 260-pin SO-DIMM CAS latency 17 Memory voltage 1

Hypertec 512MB PC133 (Legacy) memory module 0.5 GB 1 x 0.5 GB SDR SDRAM 133 MHz 3200 5 V Design Product colourA Hypertec Legacy Memory Module is a module that uses no current DRAM technology and is no longer in mainstream production by OEMS and or third party suppliers. Hypertec are committed to providing a full memory upgrade landscape as part of our core product offering and as such, there may be occasions where we need to utilise professionally repurposed components. Any repurposed components are removed within a full ESD environment and then used to